Multichip-on-flex plastic encapsulated MHDI-low cost substrateless manufacturing for microwave and millimeterwave modules

Author

Cooper, P.D. ; Piacente, P.A. ; Street, R.J.

Author_Institution

Microwave Electron. Div., Sanders Associates Inc., Nashua, NH, USA

Volume

1

fYear

1996

fDate

17-21 June 1996

Firstpage

219

Abstract

This paper describes Chip-on-Flex (COF) technology developed by Lockheed Martin/GE as a low cost derivative of the LM/GE Microwave High Density Interconnect (MHDI) technology. Cost take-out is being achieved by directly mounting MMIC chips onto a pre-fabricated polyimide flex circuit eliminating the need to procure expensive ceramic or metal substrates. Structural rigidity is provided by molded plastic to encapsulate the back of the chips. A C-Band T/R module is reported as the proof-of-concept demonstration vehicle, with up to 3.5 watts RF output having been measured over 5 to 6 GHz.

Keywords

MMIC; encapsulation; integrated circuit interconnections; integrated circuit packaging; multichip modules; plastic packaging; transceivers; 3.5 W; 5 to 6 GHz; C-Band T/R module; Chip-on-Flex technology; MMIC chips; Microwave High Density Interconnect technology; RF output power; low cost substrateless manufacturing; microwave modules; millimeterwave modules; multichip-on-flex plastic encapsulated MHDI; polyimide flex circuit; Ceramics; Costs; Flexible electronics; Integrated circuit interconnections; MMICs; Microwave technology; Plastics; Polyimides; Radio frequency; Vehicles;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Symposium Digest, 1996., IEEE MTT-S International

Conference_Location

San Francisco, CA, USA

ISSN

0149-645X

Print_ISBN

0-7803-3246-6

Type

conf

DOI

10.1109/MWSYM.1996.508497

Filename

508497