Title :
Thermally enhanced plastic packages using diamond for microwave applications
Author :
Gomes-Casseres, M. ; Fabis, P.M.
Author_Institution :
Sanders Associates Inc., Nashua, NH, USA
Abstract :
Superior material properties of CVD combined with the economics of plastic provide an improved thermal management solution for microwave packages. The thermomechanical issues of attaching Gallium Arsenide devices to diamond have been investigated. Results indicate that a 43% decrease in maximum junction temperature and a 10/sup 6/ increase in mean time between failure has been achieved. In addition, an insertion loss of <1.5 dB and a VSWR of 1.5:1 was achieved for a 1 inch long 50 /spl Omega/ coplanar transmission line up to 20 GHz.
Keywords :
CVD coatings; III-V semiconductors; MMIC; diamond; gallium arsenide; integrated circuit packaging; plastic packaging; 1.5 dB; 20 GHz; C; CVD; GaAs; VSWR; coplanar transmission line; diamond; gallium arsenide MMICs; insertion loss; junction temperature; mean time between failure; microwave packages; plastic packages; thermal management; thermomechanical analysis; Gallium arsenide; Insertion loss; Joining processes; Material properties; Microwave devices; Plastic packaging; Propagation losses; Temperature; Thermal management; Thermomechanical processes;
Conference_Titel :
Microwave Symposium Digest, 1996., IEEE MTT-S International
Conference_Location :
San Francisco, CA, USA
Print_ISBN :
0-7803-3246-6
DOI :
10.1109/MWSYM.1996.508499
