Title :
Solder free interconnects for mixed signal (DC/microwave) systems
Author :
Strack, D. ; Fudem, H. ; Kuss, F. ; Marsh, W. ; Costello, J.
Author_Institution :
Westinghouse Electr. Corp., Baltimore, MD, USA
Abstract :
A method of achieving high density interconnections is demonstrated through the use of solder free interconnects, between multilayer substrates in which a common technology can be used for both microwave and DC interconnects of large electronic systems.
Keywords :
integrated circuit interconnections; microwave integrated circuits; DC systems; high density interconnections; microwave systems; mixed signal electronic systems; multilayer substrates; solder free interconnects; Ceramics; Coaxial components; Costs; Dielectrics; Electronics packaging; Logic arrays; Logic design; Microwave theory and techniques; Nonhomogeneous media; Temperature;
Conference_Titel :
Microwave Symposium Digest, 1996., IEEE MTT-S International
Conference_Location :
San Francisco, CA, USA
Print_ISBN :
0-7803-3246-6
DOI :
10.1109/MWSYM.1996.508500
