Title :
1Gb/s Ethernet physical layer device package development
Author :
Mathew, Ranjan ; Wang, Michael ; Hu, Jinsong ; Chen, Qinghua ; Cowen, Chuck ; Gifford, Elena ; Ivanir, Effi
Author_Institution :
Assembly Technol. Dev., Intel Corp., Santa Clara, CA
Abstract :
The 82566 family of LAN products are Intel LAN Access Division´s (LAD) generation 90nm silicon gigabit LAN connection devices with an integrated PHY, designed in a 2 layer flip chip molded matrix array package (FCMMAP). The use of 2 layer FCMMAP technologies leveraged a number of cost reduction, thermal performance and design improvements offered over an alternative 4 layer stacks up. This paper describes the various design and electrical performance optimizations that were implemented to achieve an improved package design to meet the requirements for the high speed proprietary SerDeS and gigabit PHY interfaces
Keywords :
flip-chip devices; local area networks; network interfaces; telecommunication equipment; 1 Gbit/s; 82566 family; 90 nm; Ethernet physical layer device; LAN products; SerDeS interface; electrical performance optimizations; flip chip molded matrix array package; gigabit LAN connection devices; gigabit PHY interfaces; integrated PHY; package development; thermal performance; Bandwidth; Ethernet networks; Flip chip; Light emitting diodes; Local area networks; Mobile computing; Packaging; Physical layer; Silicon; Technology management;
Conference_Titel :
Electronic Components and Technology Conference, 2006. Proceedings. 56th
Conference_Location :
San Diego, CA
Print_ISBN :
1-4244-0152-6
DOI :
10.1109/ECTC.2006.1645623
