Title :
Integration of laser control technology with i-GLV to directly image high-resolution patterns for advanced 3D packaging
Author :
Matsui, H. ; Kawamura, N. ; Snow, J.
Author_Institution :
Dainippon Screen Manuf. Co., Ltd., Kyoto, Japan
Abstract :
A recently developed optical-write tool, incorporating a high-output laser with integrated grating light valve (i-GLV), has successfully been used to directly image high-resolution patterns useful for three-dimensional packaging schemes. This technology thus eliminates the need for masks for pattern creation. Automatic correction for any warpage from ultra-thin wafers is performed using a proprietary imaging technology. Different levels of dose intensity can be imaged on the resist in one exposure.
Keywords :
integrated circuit packaging; light valves; masks; three-dimensional integrated circuits; advanced 3D packaging; dose intensity level; high-output laser; high-resolution pattern; i-GLV; integrated grating light valve; laser control technology; optical-write tool; three-dimensional packaging scheme; ultra-thin wafer; Adaptive optics; Lasers; Optical distortion; Packaging; Resists; Three dimensional displays; Through-silicon vias; 3D packaging; GLV; TSV; direct write;
Conference_Titel :
Microelectronics and Electron Devices (WMED), 2012 IEEE Workshop on
Conference_Location :
Boise, ID
Print_ISBN :
978-1-4577-1735-2
DOI :
10.1109/WMED.2012.6202615