Step deposition and stabilizer interaction in electroless nickel bath for bond pad metallization

Stabilizers are key components of electroless nickel baths. Therefore, understanding the limitations and characteristics of stabilizers is very important for consistently achieving desired plating results. Higher concentrations of stabilizers cause defects like skip and step plating, whereas lower concentrations can lead to short bath life and bath decomposition. This paper studies the step deposition and stabilizer interaction on electroless nickel bath.