Title :
Flip Chip and TAB Interconnects for Millimeter Wave MMICs a Comprehensive Study
Author :
Dravet, Alain ; Desplan, Didier ; Haese, Nathalie ; Rolland, Pierre Alain
Author_Institution :
Dassault Electronique, 55 Quai Marcel Dassault - 92214 SAINT CLOUD - France. E.mail: Alain.Dravet@dassault-elec.fr
Abstract :
This paper presents simulation results performed with a 3D FEM Software on flip chip and tape automated bonding interconnect of MMICs at millimeter wave frequencies (40 - 60 Ghz). Parasitic propagation modes for CPW flip chip mounted MMICs are pointed out with proposed solution. Measurement results obtained with LNA 38 and 55 GHz microstrip MMICs connected to alumina substrates with a 50 ¿ coplanar tape are presented and show goodagreement compared to bare MMICs and to simulations.
Keywords :
Bonding; Coplanar waveguides; Flip chip; Frequency; MMICs; Microstrip; Millimeter wave measurements; Millimeter wave propagation; Semiconductor device measurement; Software performance;
Conference_Titel :
Microwave Conference, 1998. 28th European
Conference_Location :
Amsterdam, Netherlands
DOI :
10.1109/EUMA.1998.338000
