• DocumentCode
    2139172
  • Title

    An algorithmic study of DDR3 SDRAM on-die termination switch timings

  • Author

    Wong, S.N.

  • Author_Institution
    Test Eng., Micron Semicond. Asia Pte. Ltd., Singapore, Singapore
  • fYear
    2012
  • fDate
    20-20 April 2012
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Given the increasing clock signaling rates used by digital memory subsystems, it has become progressively more important that DDR3 SDRAM provide well-controlled impedance to the signal transmission path. The DDR3 specification requires flexible termination, and conformance to analog timing specifications under various operating modes is necessary to ensure reliable system operation. The direct measurement and test of these timings is not possible using simple pass/fail voltage comparators, in the absence of purpose-built hardware (to measure the linear-extrapolated voltage slew rates as defined in the specifications sheet). To get around this limitation, these timing limits are tested in the backend component test flows with two test comparator strobes (per spec) placed at alternative timing and voltage positions. These strobes judge and ensure compliance to MIN and MAX (fastest and slowest) ODT transition timings. The selection of voltage-level and timing-edge offsets requires time-consuming analysis of “shmoo” charts, which are test comparator pass/fail results plotted out across different voltage and timing sweep positions. In this paper, we will share the theory behind an algorithm to visually recognize and extract various signal transition metrics, including slew rates, spec/test points, test-point, and voltage/time offsets from shmoo charts automatically.
  • Keywords
    DRAM chips; comparators (circuits); electric impedance; extrapolation; integrated circuit reliability; integrated circuit testing; timing circuits; DDR3 SDRAM on-die termination switch timings; DDR3 specification; analog timing specification; backend component test flow; clock signaling rate; comparator strobe; digital memory subsystem; flexible termination; impedance; linear-extrapolated voltage slew rate; max ODT transition timings; min ODT transition timings; pass/fail voltage comparator; purpose-built hardware; reliable system operation; shmoo chart; signal transition metrics; signal transmission path; spec/test points; test comparator pass/fail result; test-point; time-consuming analysis; timing limits; timing sweep position; timing-edge offset; voltage-level offset; voltage/time offset; Heuristic algorithms; Image edge detection; Impedance; Manuals; Semiconductor device measurement; Timing; Voltage measurement; DDR3; Tester enhancement; on-die termination;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microelectronics and Electron Devices (WMED), 2012 IEEE Workshop on
  • Conference_Location
    Boise, ID
  • ISSN
    1947-3834
  • Print_ISBN
    978-1-4577-1735-2
  • Type

    conf

  • DOI
    10.1109/WMED.2012.6202619
  • Filename
    6202619