DocumentCode
2139252
Title
Dispersive effects of a thin metal-insulating layer in MMIC structures
Author
Polycarpou, A.C. ; Lyons, M.R. ; Balanis, C.A.
Author_Institution
Dept. of Electr. Eng., Arizona State Univ., Tempe, AZ, USA
Volume
1
fYear
1996
fDate
17-21 June 1996
Firstpage
303
Abstract
A full-wave finite element analysis is used to examine the dispersive effects of a thin metal-insulating layer in CPW and microstrip MMICs. This layer is often encountered in the MMIC manufacturing process residing on top of a semiconducting substrate. The effects of metallization thickness are also examined.
Keywords
MMIC; coplanar waveguides; dispersion (wave); finite element analysis; integrated circuit metallisation; microstrip circuits; CPW; MMIC manufacturing process; MMIC structures; dispersive effects; full-wave finite element analysis; metal-insulating layer; metallization thickness; microstrip MMICs; semiconducting substrate; Coplanar waveguides; Dielectrics and electrical insulation; Dispersion; Finite element methods; Frequency dependence; Impedance; Isolation technology; MMICs; Microstrip; Substrates;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest, 1996., IEEE MTT-S International
Conference_Location
San Francisco, CA, USA
ISSN
0149-645X
Print_ISBN
0-7803-3246-6
Type
conf
DOI
10.1109/MWSYM.1996.508517
Filename
508517
Link To Document