DocumentCode
2139370
Title
A large number of I/O connections using compliant bump
Author
Watanabe, Naoya ; Asano, Tanemasa
Author_Institution
Center for Microelectron. Syst., Kyushu Inst. of Technol., Fukuoka
fYear
0
fDate
0-0 0
Abstract
We demonstrate a large number of I/O connections (number of bumps: 10,000, size/pitch: 10 mum/20 mum) using the compliant bump. The bump connection test was carried out by using not only daisy chain but also active-matrix switch array. These tests revealed that the compliant bump suppresses the bonding failure. We also demonstrate that the compliant bump is very effective in reducing the change in characteristic of MOSFET even when bump bonding is performed directly on the MOSFET
Keywords
conformance testing; integrated circuit bonding; integrated circuit interconnections; 10 micron; 20 micron; I/O connections; MOSFET; bonding failure; bump bonding; bump connection test; compliant bump; Active matrix technology; Bonding; Capacitive sensors; Gold; MOSFET circuits; Resists; Sensor arrays; Switches; Temperature; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2006. Proceedings. 56th
Conference_Location
San Diego, CA
ISSN
0569-5503
Print_ISBN
1-4244-0152-6
Type
conf
DOI
10.1109/ECTC.2006.1645635
Filename
1645635
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