Title :
A large number of I/O connections using compliant bump
Author :
Watanabe, Naoya ; Asano, Tanemasa
Author_Institution :
Center for Microelectron. Syst., Kyushu Inst. of Technol., Fukuoka
Abstract :
We demonstrate a large number of I/O connections (number of bumps: 10,000, size/pitch: 10 mum/20 mum) using the compliant bump. The bump connection test was carried out by using not only daisy chain but also active-matrix switch array. These tests revealed that the compliant bump suppresses the bonding failure. We also demonstrate that the compliant bump is very effective in reducing the change in characteristic of MOSFET even when bump bonding is performed directly on the MOSFET
Keywords :
conformance testing; integrated circuit bonding; integrated circuit interconnections; 10 micron; 20 micron; I/O connections; MOSFET; bonding failure; bump bonding; bump connection test; compliant bump; Active matrix technology; Bonding; Capacitive sensors; Gold; MOSFET circuits; Resists; Sensor arrays; Switches; Temperature; Testing;
Conference_Titel :
Electronic Components and Technology Conference, 2006. Proceedings. 56th
Conference_Location :
San Diego, CA
Print_ISBN :
1-4244-0152-6
DOI :
10.1109/ECTC.2006.1645635
