Title :
3-D modeling of interconnects in MMICs by the method of lines
Author :
Vietzorreck, L. ; Pregla, R.
Author_Institution :
Allgemeine & Theor. Elektronik, FernUniversitat Hagen, Germany
Abstract :
A new eigenmode algorithm, based on the method of lines, is presented for full-wave analysis of real 3-D structures. Finite conductor thickness, finite substrate and very short or long interconnection are rigorously modelled. S-parameters of air bridges, via holes and bead transitions investigated agree very well with literature.
Keywords :
MMIC; S-parameters; eigenvalues and eigenfunctions; integrated circuit interconnections; integrated circuit modelling; 3D modeling; MMICs; S-parameters; air bridges; bead transitions; eigenmode algorithm; full-wave analysis; interconnects; method of lines; via holes; Bridge circuits; Distributed parameter circuits; Finite difference methods; Integrated circuit interconnections; MMICs; Metallization; Microwave propagation; Planar transmission lines; Three dimensional displays; Transmission line theory;
Conference_Titel :
Microwave Symposium Digest, 1996., IEEE MTT-S International
Conference_Location :
San Francisco, CA, USA
Print_ISBN :
0-7803-3246-6
DOI :
10.1109/MWSYM.1996.508527
