Thermal interface material with aligned CNT and its application in HB-LED packaging

Author

Zhang, K. ; Yuen, Matthew M F ; Wang, N. ; Miao, J.Y. ; Xiao, David G W ; Fan, H.B.

Author_Institution

Dept. of Mech. Eng., Hong Kong Univ. of Sci., Kowloon

fYear

0

fDate

0-0 0

Abstract

High density well aligned vertical CNT arrays were synthesized by thermal chemical vapor deposition (CVD) method on 1 inch by 1 inch Si substrates with sputtered Ti and Si layers. They were used as a new kind of thermal interface material (TIM) for the thermal management of microelectronic packages and high brightness light emitting diode (HB-LED) packages. The thermal resistance of the CNT-array-TIM and some other TIM were evaluated and compared according to ASTM D5470 standard. The thermal resistance of CNT-array-TIM was found to be 15 mm²-K/W which was only 20% of that of the commercial silver epoxy. The mechanism of the phonon heat transfer through the CNT-array-TIM was reviewed. The application performance of CNT-array-TIM in HB-LED packages was predicted by finite element analysis using ANSYS code. It was concluded that CNT arrays synthesized by the simple thermal CVD procedure is a promising low cost and effective TIM

Keywords

CVD coatings; carbon nanotubes; electronics packaging; finite element analysis; light emitting diodes; thermal management (packaging); thermal resistance; 1 in; ANSYS code; ASTM D5470 standard; HB-LED packaging; aligned carbon naotube; finite element analysis; light emitting diode; microelectronic packages; phonon heat transfer; thermal chemical vapor deposition; thermal interface material; thermal management; thermal resistance; Brightness; Chemical vapor deposition; Heat transfer; Light emitting diodes; Microelectronics; Packaging; Phonons; Silver; Thermal management; Thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2006. Proceedings. 56th

Conference_Location

San Diego, CA

ISSN

0569-5503

Print_ISBN

1-4244-0152-6

Type

conf

DOI

10.1109/ECTC.2006.1645644

Filename

1645644