Title :
Power delivery design for 800MHz DDR2 memory systems in low-cost wire-bond packages
Author :
Schmitt, Ralf ; Kim, Joong-Ho ; Oh, Dan ; Yuan, Chuck
Author_Institution :
Rambus Inc., Los Altos, CA
Abstract :
This paper describes the challenges in designing supply networks of high-speed interface systems in low-cost wire-bond packages. It introduces a set of figure-of-merits for the supply noise performance of interface systems. It then demonstrates how these parameters can be used to guide the design and verification of interface power distribution networks
Keywords :
DRAM chips; integrated circuit packaging; lead bonding; power supply circuits; 800 MHz; DDR2 memory; figure-of-merits; high-speed interface systems; interface power distribution; power delivery; supply noise performance; wire-bond packages; Bandwidth; Circuit noise; Design methodology; Impedance; Noise figure; Packaging; Power distribution; Power systems; Rails; Silicon;
Conference_Titel :
Electronic Components and Technology Conference, 2006. Proceedings. 56th
Conference_Location :
San Diego, CA
Print_ISBN :
1-4244-0152-6
DOI :
10.1109/ECTC.2006.1645651
