Title :
Integrated board-level phased array antenna solution for 60 GHz radio
Author :
Hong, Wonbin ; Baek, Kwang-hyun ; Goudelev, Alexander
Author_Institution :
DMC Res. Center, Samsung Electron., Suwon, South Korea
Abstract :
A novel integrated board-level phased array antenna package devised using low-cost, high volume PCB (FR4) is presented. The presented antenna topology eliminates the need for ball grid array (BGA)/land grid array (LGA) type surface mount packaging as the antenna is directly embedded in the circuit board. This results in significant reduction in fabrication and mass production cost. A multi-element array antenna prototype is simulated, fabricated and measured and its performance is determined to be applicable for gigabit WiFi such as WiGig and IEEE 802.11ad.
Keywords :
antenna phased arrays; ball grid arrays; radio networks; wireless LAN; BGA; FR4; IEEE 802.11ad; WiGig; antenna topology; ball grid array; gigabit Wi-Fi; high volume PCB; integrated board-level phased array antenna solution; land grid array type surface mount packaging; mass production cost; multielement array antenna prototype; radio network; Antenna measurements; Arrays; Phased arrays; Printed circuits; Substrates;
Conference_Titel :
Antennas and Propagation Society International Symposium (APSURSI), 2012 IEEE
Conference_Location :
Chicago, IL
Print_ISBN :
978-1-4673-0461-0
DOI :
10.1109/APS.2012.6348521
