Novel optoelectronic LSI packaging suitable for standard FR-4 printed wiring board with bandwidth capability of over 1 Tbps

A novel optoelectronic LSI package using a post-reflow optical-interface stacking technique (POST), which enables high speed operation at more than 10 Gbps/ch on the standard FR-4 PWB was proposed. The POST LSI package includes an interposer and an optical interface module. A slightly modified interposer is used where electrical contacts for high speed signals are added on the top surface. After the reflow process of the interposer, the optical interface module was connected to the interposer through the electrical contacts. The POST LSI package enables the use of the standard FR-4 solder reflow process for the optoelectronic LSI packaging, and realizes a cost-effective package with a bandwidth of over 1 Tbps