• DocumentCode
    2140444
  • Title

    Are the Clients of Flawed Classes (Also) Defect Prone?

  • Author

    Marinescu, Radu ; Marinescu, Cristina

  • Author_Institution
    LOOSE Res. Group Politeh., Univ. of Timisoara, Timisoara, Romania
  • fYear
    2011
  • fDate
    25-26 Sept. 2011
  • Firstpage
    65
  • Lastpage
    74
  • Abstract
    Design flaws are those characteristics of design entities (e.g., methods, classes) which make them harder to maintain. Existing studies show that classes revealing particular design flaws are more change and defect prone than the other classes. Since various collaborations are found among the instances of classes, classes are not isolated within the source code of object-oriented systems. In this paper we investigate if classes using classes revealing design flaws are more defect prone than classes which do not use classes revealing design flaws. We detect four design flaws in three releases of Eclipse and investigate the relation between classes that use/do not use flawed classes and defects. The results show that classes that use flawed classes are defect prone and this does not depend on the number of the used flawed classes. This findings show a new type of correlation between design flaws and defects, bringing evidence related to an increased likelihood of exhibiting defects for classes that use classes revealing design flaws. Based on the provided evidence, practitioners are advised once again about the negative impact design flaws have at a source code level.
  • Keywords
    object-oriented methods; software maintenance; source coding; Eclipse; class revealing design flaw; defect prone; object oriented system; source code; Correlation; Data mining; Feature extraction; Java; Maintenance engineering; Measurement; Software; defects; design flaws; detection strategies; empirical software engineering; software repositories; source code;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Source Code Analysis and Manipulation (SCAM), 2011 11th IEEE International Working Conference on
  • Conference_Location
    Williamsburg, VI
  • Print_ISBN
    978-1-4577-0932-6
  • Type

    conf

  • DOI
    10.1109/SCAM.2011.9
  • Filename
    6065198