DocumentCode
2140704
Title
New insight into hot-electron-induced degradation of n-MOSFETs
Author
Chan, T.Y. ; Chiang, C.L. ; Gaw, H.
Author_Institution
Intel Corp., Santa Clara, CA, USA
fYear
1988
fDate
11-14 Dec. 1988
Firstpage
196
Lastpage
199
Abstract
The channel electric field is found to be as important as the substrate current in understanding hot-electron-induced (MOSFET) degradation. It is shown that only when the combined effect of the channel field and substrate current is considered can all the experimental results, covering a wide range of bias conditions, channel lengths, and oxide thickness, be fully accounted for. It is demonstrated that long-channel MOSFETs are still prone to hot-electron-induced degradation in analog circuits where a 10-V supply is used. A novel characterization methodology to ensure hot-electron reliability in various types of circuits is presented.<>
Keywords
hot carriers; insulated gate field effect transistors; reliability; semiconductor device testing; MOSFETs; analog circuits; bias conditions; channel electric field; channel lengths; characterization methodology; hot-electron reliability; hot-electron-induced degradation; oxide thickness; substrate current; Analog circuits; Analytical models; Current measurement; Degradation; Hot carriers; Ice thickness; MOSFET circuits; Time measurement; Very large scale integration; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 1988. IEDM '88. Technical Digest., International
Conference_Location
San Francisco, CA, USA
ISSN
0163-1918
Type
conf
DOI
10.1109/IEDM.1988.32789
Filename
32789
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