• DocumentCode
    2140704
  • Title

    New insight into hot-electron-induced degradation of n-MOSFETs

  • Author

    Chan, T.Y. ; Chiang, C.L. ; Gaw, H.

  • Author_Institution
    Intel Corp., Santa Clara, CA, USA
  • fYear
    1988
  • fDate
    11-14 Dec. 1988
  • Firstpage
    196
  • Lastpage
    199
  • Abstract
    The channel electric field is found to be as important as the substrate current in understanding hot-electron-induced (MOSFET) degradation. It is shown that only when the combined effect of the channel field and substrate current is considered can all the experimental results, covering a wide range of bias conditions, channel lengths, and oxide thickness, be fully accounted for. It is demonstrated that long-channel MOSFETs are still prone to hot-electron-induced degradation in analog circuits where a 10-V supply is used. A novel characterization methodology to ensure hot-electron reliability in various types of circuits is presented.<>
  • Keywords
    hot carriers; insulated gate field effect transistors; reliability; semiconductor device testing; MOSFETs; analog circuits; bias conditions; channel electric field; channel lengths; characterization methodology; hot-electron reliability; hot-electron-induced degradation; oxide thickness; substrate current; Analog circuits; Analytical models; Current measurement; Degradation; Hot carriers; Ice thickness; MOSFET circuits; Time measurement; Very large scale integration; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 1988. IEDM '88. Technical Digest., International
  • Conference_Location
    San Francisco, CA, USA
  • ISSN
    0163-1918
  • Type

    conf

  • DOI
    10.1109/IEDM.1988.32789
  • Filename
    32789