DocumentCode :
2141265
Title :
An embedded device technology based on a molded reconfigured wafer
Author :
Brunnbauer, M. ; Fürgut, E. ; Beer, G. ; Meyer, T. ; Hedler, H. ; Belonio, J. ; Nomura, E. ; Kiuchi, K. ; Kobayashi, K.
Author_Institution :
Infineon Technol. AG, Regensburg
fYear :
0
fDate :
0-0 0
Abstract :
We report an innovative embedded device wafer level packaging technology based on a "molded reconfigured 200 mm wafer". Silicon dice are tested, grinded, and diced. For the set-up of the "reconfigured wafer" these bare silicon dice are placed faces down onto a carrier system. The core process of this technology is the encapsulation of silicon dice. We demonstrate that compression molding is a promising approach with respect to robust processing, topology, adhesion, and reliability properties. The "molded reconfigured wafer" is the base to apply thin-film interconnects similar to back-end of line processes
Keywords :
compression moulding; encapsulation; integrated circuit packaging; silicon; 200 mm; Si; adhesion properties; compression molding; embedded device technology; molded reconfigured wafer; reliability properties; silicon dice encapsulation; thin-film interconnects; topology properties; wafer level packaging technology; Assembly; Chemical technology; Costs; Electronic packaging thermal management; Laminates; Semiconductor device packaging; Silicon; Space technology; Testing; Wafer scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2006. Proceedings. 56th
Conference_Location :
San Diego, CA
ISSN :
0569-5503
Print_ISBN :
1-4244-0152-6
Type :
conf
DOI :
10.1109/ECTC.2006.1645702
Filename :
1645702
Link To Document :
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