DocumentCode
2141525
Title
Silicon nanowire CMOSFETs : Fabrication, characteristics, and memory application
Author
Park, Donggun
Author_Institution
Memory Div., Samsung Electron. Co., Hwasung, South Korea
fYear
2008
fDate
20-23 Oct. 2008
Firstpage
25
Lastpage
28
Abstract
Continuous device scaling has led to the development of various transistors such as Ultra-Thin-Body SOI MOSFET, FinFET, and gate all around (GAA) MOSFETs . As the device shrinks further, the ultimate MOSFET structure would be GAA nanowire MOSFET with a fully depleted channel thoroughly controlled by the gate electrode. In this paper, fabrication processes of silicon nanowire MOSFETs on bulk Si using top-down method, their characteristics including 1D and quantum dot characteristics will be reported. Also applicable examples to memory devices such as SRAM and NAND Flash will be demonstrated.
Keywords
CMOS integrated circuits; MOSFET; elemental semiconductors; nanoelectronics; nanowires; semiconductor quantum dots; semiconductor storage; silicon; 1D characteristics; CMOSFET; FinFET; NAND flash; SRAM; Si; memory devices; quantum dot; silicon nanowire MOSFET; top-down method; ultrathin-body SOI MOSFET; CMOSFETs; Electrodes; Fabrication; FinFETs; MOSFET circuits; Nanoscale devices; Quantum dots; Random access memory; Silicon; Transistors;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State and Integrated-Circuit Technology, 2008. ICSICT 2008. 9th International Conference on
Conference_Location
Beijing
Print_ISBN
978-1-4244-2185-5
Electronic_ISBN
978-1-4244-2186-2
Type
conf
DOI
10.1109/ICSICT.2008.4734467
Filename
4734467
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