Title : 
Road-blocks to Tera-level nanoelectronics
         
        
            Author : 
Lee, Jo-Won ; Kim, Moonkyung
         
        
            Author_Institution : 
Nat. Program for Tera-level Nano Devices, Seoul, South Korea
         
        
        
        
        
        
            Abstract : 
The national program for Tera-level Nanodevices (TND) serves as a frontier research resource to a broad range of nanoscale electronics areas. Outstanding nanoscale devices have been achieved and are being further developed using core technologies such as fast nanoscale molecular assembly, damage-free nano-etch process with a neutral beam and nano-rod and particle formation technology. Sub-30 nm scale nonvolatile memory arrays have been demonstrated by changing structures and materials. Using high quality heterojunction epitaxial growth technology, ultra high speed HEMT devices have been demonstrated with cut-off frequencies of approximately 610 GHz corresponding to gate length of 15 nm. Additionally, single electron transistor logic circuits have been extended to multi-valued static random access memory applications.
         
        
            Keywords : 
epitaxial growth; etching; high electron mobility transistors; logic circuits; nanoelectronics; single electron transistors; cut-off frequencies; damage-free nanoetch process; heterojunction epitaxial growth technology; multivalued static random access memory; nanorod; nanoscale molecular assembly; neutral beam; nonvolatile memory arrays; particle formation technology; single electron transistor logic circuits; teralevel nanodevices; teralevel nanoelectronics; ultrahigh speed HEMT devices; Assembly; Epitaxial growth; Heterojunctions; Molecular beam applications; Molecular beam epitaxial growth; Molecular beams; Nanoelectronics; Nanoscale devices; Nonvolatile memory; Particle beams;
         
        
        
        
            Conference_Titel : 
Solid-State and Integrated-Circuit Technology, 2008. ICSICT 2008. 9th International Conference on
         
        
            Conference_Location : 
Beijing
         
        
            Print_ISBN : 
978-1-4244-2185-5
         
        
            Electronic_ISBN : 
978-1-4244-2186-2
         
        
        
            DOI : 
10.1109/ICSICT.2008.4734470