Title :
A study on ranking of commercial fluxes for electrochemical migration (ECM) propensity for Cu, Sn and Ag surface finishes
Author :
Canumalla, S. ; Ludwig, K. ; Pedigo, R. ; Fitzgerald, T.
Author_Institution :
Nokia, Irving, TX
Abstract :
This study extends the water drop test to allow for quantitative measurement of the electrochemical migration (ECM) behavior of several commercial solder fluxes. The technique developed affords a quick and approximate way to rank and select fluxes based on ECM propensity in applications where condensing humidity or ingress of liquids occurs in the use environment
Keywords :
copper alloys; electromigration; silver alloys; solders; surface finishing; tin alloys; Ag; Cu; ECM propensity; Sn; electrochemical migration; solder fluxes; surface finishing; water drop test; Costs; Electrochemical machining; Electronic countermeasures; Electronic equipment testing; Humidity; Insulation; Pollution measurement; Surface finishing; Surface resistance; Tin;
Conference_Titel :
Electronic Components and Technology Conference, 2006. Proceedings. 56th
Conference_Location :
San Diego, CA
Print_ISBN :
1-4244-0152-6
DOI :
10.1109/ECTC.2006.1645715
