DocumentCode :
2141829
Title :
The state-of-the-art mobility enhancing schemes for high-performance logic CMOS technologies
Author :
Chung, Steve S.
Author_Institution :
Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
fYear :
2008
fDate :
20-23 Oct. 2008
Firstpage :
100
Lastpage :
104
Abstract :
In this talk, an overview of the mobility enhancing techniques for high performance/low power CMOS technologies will be introduced first. Three categories of mobility enhancing schemes with global strain, local strain, and hybrid-substrate engineering, will be discussed next. Either nMOSET or pMOSFET has their respective strategies for achieving the best device performance. However, the strain technique has indeed raised reliability issues. Different reliability issues have been observed for different strain technologies. In the past several years, we have paid much more attention on the current performance of these technologies, the device reliability study has not been sufficient in the previous studies. As a consequence, this talk will also address the importance of these mobility enhancing schemes and their impact on the device reliability for advanced CMOS technologies which utilize strain schemes for current enhancement.
Keywords :
CMOS logic circuits; MOSFET; carrier mobility; integrated circuit reliability; low-power electronics; semiconductor device reliability; device reliability; global strain; hybrid-substrate engineering; local strain; logic CMOS technologies; low power CMOS technologies; mobility enhancing schemes; nMOSET; pMOSFET; strain technologies; CMOS logic circuits; CMOS technology; Capacitive sensors; Germanium silicon alloys; Logic devices; MOSFET circuits; Manufacturing; Power engineering and energy; Reliability engineering; Silicon germanium;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State and Integrated-Circuit Technology, 2008. ICSICT 2008. 9th International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-2185-5
Electronic_ISBN :
978-1-4244-2186-2
Type :
conf
DOI :
10.1109/ICSICT.2008.4734481
Filename :
4734481
Link To Document :
بازگشت