DocumentCode
2142048
Title
Low temperature co-fired ceramics for micro-fluidics
Author
Youngsman, John ; Marx, Brian ; Schimpf, Martin ; Wolter, Scott ; Glass, Jeff ; Moll, Amy
Author_Institution
Dept. of Material Sci. & Eng., Boise State Univ., ID
fYear
0
fDate
0-0 0
Abstract
The miniaturization of analytical instruments and packaging of novel sensors is an area that has attracted significant research interest and offers many opportunities for product commercialization. Low temperature co-fired ceramics (LTCC) is a materials system composed of alumina and glass in an organic binder. LTCC is a good choice for sensor development because of the ease of incorporating features in the `green´ or unfired state such as electrical traces, fluidic pathways and passive electrical components. After a firing cycle, what remains is a robust, monolithic device with features embedded in the package. In order for LTCC to be a successful medium for small scale sensors or lab-in-package devices, fluid flow through channels and inlet/outlet ports must be perfected. Device inlet/outlet ports have been demonstrated by embedding sapphire tubes in LTCC, allowing external connections using compression fittings. Channels and cavities have been fabricated through the use of sacrificial carbon tapes and pastes. A field flow fractionation device used for separating or concentrating constituent components in a fluid and a multi-electrode electrochemical cell were fabricated with the techniques described in this paper
Keywords
alumina; ceramic packaging; glass; microfluidics; Al2O3; carbon pastes; carbon tapes; compression fittings; field flow fractionation device; fluid flow; lab-in-package devices; low temperature co-fired ceramics; microfluidics; monolithic device; multielectrode electrochemical cell; organic binder; sapphire tubes; Ceramics; Commercialization; Firing; Glass; Instruments; Organic materials; Packaging; Robustness; Sensor phenomena and characterization; Temperature sensors;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2006. Proceedings. 56th
Conference_Location
San Diego, CA
ISSN
0569-5503
Print_ISBN
1-4244-0152-6
Type
conf
DOI
10.1109/ECTC.2006.1645733
Filename
1645733
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