DocumentCode :
2142048
Title :
Low temperature co-fired ceramics for micro-fluidics
Author :
Youngsman, John ; Marx, Brian ; Schimpf, Martin ; Wolter, Scott ; Glass, Jeff ; Moll, Amy
Author_Institution :
Dept. of Material Sci. & Eng., Boise State Univ., ID
fYear :
0
fDate :
0-0 0
Abstract :
The miniaturization of analytical instruments and packaging of novel sensors is an area that has attracted significant research interest and offers many opportunities for product commercialization. Low temperature co-fired ceramics (LTCC) is a materials system composed of alumina and glass in an organic binder. LTCC is a good choice for sensor development because of the ease of incorporating features in the `green´ or unfired state such as electrical traces, fluidic pathways and passive electrical components. After a firing cycle, what remains is a robust, monolithic device with features embedded in the package. In order for LTCC to be a successful medium for small scale sensors or lab-in-package devices, fluid flow through channels and inlet/outlet ports must be perfected. Device inlet/outlet ports have been demonstrated by embedding sapphire tubes in LTCC, allowing external connections using compression fittings. Channels and cavities have been fabricated through the use of sacrificial carbon tapes and pastes. A field flow fractionation device used for separating or concentrating constituent components in a fluid and a multi-electrode electrochemical cell were fabricated with the techniques described in this paper
Keywords :
alumina; ceramic packaging; glass; microfluidics; Al2O3; carbon pastes; carbon tapes; compression fittings; field flow fractionation device; fluid flow; lab-in-package devices; low temperature co-fired ceramics; microfluidics; monolithic device; multielectrode electrochemical cell; organic binder; sapphire tubes; Ceramics; Commercialization; Firing; Glass; Instruments; Organic materials; Packaging; Robustness; Sensor phenomena and characterization; Temperature sensors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2006. Proceedings. 56th
Conference_Location :
San Diego, CA
ISSN :
0569-5503
Print_ISBN :
1-4244-0152-6
Type :
conf
DOI :
10.1109/ECTC.2006.1645733
Filename :
1645733
Link To Document :
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