• DocumentCode
    2142254
  • Title

    Passive alignment of optical elements in a printed circuit board

  • Author

    Lamprecht, T. ; Horst, F. ; Dangel, R. ; Beyeler, R. ; Meier, N. ; Dellmann, L. ; Gmür, M. ; Berger, C. ; Offrein, B.J.

  • Author_Institution
    Zurich Res. Lab., IBM Res. GmbH, Ruschlikon
  • fYear
    0
  • fDate
    0-0 0
  • Abstract
    A successful implementation of optics into PCBs (printed circuit boards) requires a precise passive alignment of optical elements relative to the optical waveguides in the board. We tackled this challenge with a novel concept that allows the passive alignment onto a PCB of any optical or optoelectronic building block with a precision of a few micrometers. Markers, structured into a copper layer during manufacturing, are used as a position reference for the polymer waveguide fabrication and for the formation of mechanical alignment features. To form the latter, laser drilling, a standard process for via formation in PCBs, is used. We were able to demonstrate repeated insertions of adapter elements into these alignment slots with a standard deviation of 3 mum for in-plane displacements. Afterwards, optical modules were mounted onto the adapters, using a standard MT interface provided by the adapter. We measured a standard deviation of the order of 5 mum for the in-plane and out-of-plane misalignments of the module with respect to the optical waveguides. The passive alignment concept demonstrated enables accurate and simple plug-in of any kind of element, in particular of optical and opto-electronic elements, into a PCB. The concept is based on established PCB manufacturing processes, which is crucial for the development towards a low-cost optical interconnect technology
  • Keywords
    laser materials processing; optical interconnections; optical waveguides; optoelectronic devices; printed circuits; laser drilling; optical elements; optical interconnect technology; optical waveguides; optoelectronic building block; passive alignment; polymer waveguide fabrication; position reference; printed circuit boards; Copper; Drilling; Manufacturing; Measurement standards; Optical device fabrication; Optical interconnections; Optical polymers; Optical waveguides; Printed circuits; Waveguide lasers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2006. Proceedings. 56th
  • Conference_Location
    San Diego, CA
  • ISSN
    0569-5503
  • Print_ISBN
    1-4244-0152-6
  • Type

    conf

  • DOI
    10.1109/ECTC.2006.1645743
  • Filename
    1645743