• DocumentCode
    2142419
  • Title

    Three dimensional optical interconnect on organic circuit board

  • Author

    Matsubara, Takahiro ; Oda, Keiko ; Watanabe, Keiichiro ; Tanaka, Kaori ; Maetani, Maraki ; Nishimura, Yuriko ; Tanahashi, Shigeo

  • Author_Institution
    R&D Center, Kyocera Corp., Tokyo
  • fYear
    0
  • fDate
    0-0 0
  • Abstract
    We propose high speed optical interconnection which is three dimensional optical lanes using polymer materials fabricated on an organic circuit board with metal lines and pads. These optical lanes transmit optical signals not only on a plane surface but into the other side of a circuit board. It has following three particular portions; (1) curved parallel optical waveguide; (2) 45 degree reflection mirror; (3) optical via hole. Four channel three dimensional optical lanes with current electrical lines and pads are newly developed on the organic circuit board named CPCoretrade. We characterize the optical lanes by transmission loss and passed through eye diagram, and optical signal transmission is confirmed. Then optical signal transmission up to 3Gbps/channel are demonstrated with 850nm VCSEL flip-attached on the circuit board with active and passive electronic devices and components as driving circuit
  • Keywords
    integrated optoelectronics; light transmission; optical interconnections; optical waveguides; polymers; printed circuits; surface emitting lasers; 3D optical interconnect; 850 nm; CPCore; VCSEL; optical signal transmission; optical via hole; organic circuit board; parallel optical waveguide; polymer materials; reflection mirror; High speed optical techniques; Inorganic materials; Optical interconnections; Optical materials; Optical polymers; Optical surface waves; Optical waveguide components; Optical waveguides; Organic materials; Printed circuits;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2006. Proceedings. 56th
  • Conference_Location
    San Diego, CA
  • ISSN
    0569-5503
  • Print_ISBN
    1-4244-0152-6
  • Type

    conf

  • DOI
    10.1109/ECTC.2006.1645747
  • Filename
    1645747