DocumentCode
2142419
Title
Three dimensional optical interconnect on organic circuit board
Author
Matsubara, Takahiro ; Oda, Keiko ; Watanabe, Keiichiro ; Tanaka, Kaori ; Maetani, Maraki ; Nishimura, Yuriko ; Tanahashi, Shigeo
Author_Institution
R&D Center, Kyocera Corp., Tokyo
fYear
0
fDate
0-0 0
Abstract
We propose high speed optical interconnection which is three dimensional optical lanes using polymer materials fabricated on an organic circuit board with metal lines and pads. These optical lanes transmit optical signals not only on a plane surface but into the other side of a circuit board. It has following three particular portions; (1) curved parallel optical waveguide; (2) 45 degree reflection mirror; (3) optical via hole. Four channel three dimensional optical lanes with current electrical lines and pads are newly developed on the organic circuit board named CPCoretrade. We characterize the optical lanes by transmission loss and passed through eye diagram, and optical signal transmission is confirmed. Then optical signal transmission up to 3Gbps/channel are demonstrated with 850nm VCSEL flip-attached on the circuit board with active and passive electronic devices and components as driving circuit
Keywords
integrated optoelectronics; light transmission; optical interconnections; optical waveguides; polymers; printed circuits; surface emitting lasers; 3D optical interconnect; 850 nm; CPCore; VCSEL; optical signal transmission; optical via hole; organic circuit board; parallel optical waveguide; polymer materials; reflection mirror; High speed optical techniques; Inorganic materials; Optical interconnections; Optical materials; Optical polymers; Optical surface waves; Optical waveguide components; Optical waveguides; Organic materials; Printed circuits;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2006. Proceedings. 56th
Conference_Location
San Diego, CA
ISSN
0569-5503
Print_ISBN
1-4244-0152-6
Type
conf
DOI
10.1109/ECTC.2006.1645747
Filename
1645747
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