Modeling of ESD and EMI problems in split multi-layer power distribution network

Author

Shim, Hwang-Yoon ; Kim, JiSeong ; Yook, Jong-Gwan

Author_Institution

Comput. Syst. Div., Samsung Electron., South Korea

Volume

1

fYear

2003

fDate

18-22 Aug. 2003

Firstpage

48

Abstract

ESD and EMI problems and their possible solutions are addressed for the multi-layer power distribution network of high-speed digital systems. To prevent system from ESD damage, split I/O port ground with stitching element such as conductor or inductor is proposed, while stitching and decoupling capacitors are proved to be very effective for reducing electromagnetic radiation from the split power plane. Simulations based on 3D-finite difference time domain (FDTD) method are utilized for the analysis of practical high frequency multi-layered PC mainboard.

Keywords

circuit simulation; distribution networks; electromagnetic interference; electrostatic discharge; finite difference time-domain analysis; integrated circuit modelling; 3D finite difference time domain; EMI modeling; ESD damage; ESD modeling; FDTD method; decoupling capacitor; electromagnetic interference; electromagnetic radiation; electrostatic discharge; high speed digital systems; multilayered PC mainboard; split I/O port ground; split multilayer power distribution network; split power plane; stitching capacitor; stitching element; Capacitors; Conductors; Digital systems; Electromagnetic interference; Electromagnetic radiation; Electrostatic discharge; Inductors; Power system modeling; Power systems; Time domain analysis;

fLanguage

English

Publisher

ieee

Conference_Titel

Electromagnetic Compatibility, 2003 IEEE International Symposium on

Print_ISBN

0-7803-7835-0

Type

conf

DOI

10.1109/ISEMC.2003.1236562

Filename

1236562