DocumentCode
2142841
Title
HDI organic technology integrating built-in antennas dedicated to 60 GHz SiP solution
Author
Pilard, R. ; Titz, D. ; Gianesello, F. ; Calascibetta, P. ; Rivière, J.M. ; Lopez, J. ; Coffy, R. ; Saugier, E. ; Poulain, A. ; Ferrero, F. ; Luxey, C. ; Brachat, P. ; Jacquemod, G. ; Gloria, Daniel
Author_Institution
Technol. R&D, STMicroelectron., Crolles, France
fYear
2012
fDate
8-14 July 2012
Firstpage
1
Lastpage
2
Abstract
During past years, various research teams have been implied in the development of 60 GHz chipset solutions, using both BiCMOS and advanced CMOS technologies. But for the 60 GHz market to flourish not only low cost RFICs are required, low cost antennas and packages are also key points. So far, HTCC technology has been seen as the chosen one when targeting millimeter wave (MMW) applications. But since 60 GHz applications are targeting large volume consumer applications, the pressure on the cost of the packaging will become higher and it is highly desirable to explore alternative lower cost solutions than HTCC. In this paper, we present 60GHz integrated antennas in an innovative low cost High Density Interconnect (HDI) organic technology demonstrating promising high-gain antenna solution (>; 7 dBi).
Keywords
BiCMOS analogue integrated circuits; millimetre wave antennas; radiofrequency integrated circuits; silicon compounds; BiCMOS; HDI organic technology; HTCC technology; MMW application; RFICs; SiP; built-in antenna integration; frequency 60 GHz; innovative low cost high density interconnect organic technology; low cost antenna; millimeter wave application; Antenna radiation patterns; CMOS integrated circuits; Substrates; Wireless communication;
fLanguage
English
Publisher
ieee
Conference_Titel
Antennas and Propagation Society International Symposium (APSURSI), 2012 IEEE
Conference_Location
Chicago, IL
ISSN
1522-3965
Print_ISBN
978-1-4673-0461-0
Type
conf
DOI
10.1109/APS.2012.6348633
Filename
6348633
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