• DocumentCode
    2143212
  • Title

    A conduction model for intrinsic polycrystalline silicon thin-film transistor based on energy-dispersed trap states at discrete grain boundary

  • Author

    Wong, Man ; Chow, Thomas ; Chun Cheong Wong ; Zhang, Dongli

  • Author_Institution
    Dept. of Electron. & Comput. Eng., Hong Kong Univ. of Sci. & Technol., Kowloon, China
  • fYear
    2008
  • fDate
    20-23 Oct. 2008
  • Firstpage
    272
  • Lastpage
    275
  • Abstract
    A quasi two-dimensional conduction model based on the thermionic emission of charge carriers over the energy barriers at discrete grain boundaries is proposed. The grain boundaries are characterized by an energy-dispersed density of trap states and a conduction model is formulated for a polycrystalline silicon thin-film transistor with an intrinsic channel. A ¿line¿ charge is formed adjacent to the interface of the channel and gate dielectric of the transistor by the occupied trap states and the electrostatic potential of a grain boundary is subsequently determined. This general approach allows the modeling of energy barriers for a transistor with an intrinsic channel and the resulting conduction model is continuously applicable from the ¿pseudo sub-threshold¿ to the `linear¿ regime of operation of a transistor.
  • Keywords
    electric potential; elemental semiconductors; silicon; thin film transistors; Si; discrete grain boundary; electrostatic potential; energy barriers; energy-dispersed trap states; gate dielectric; intrinsic channel; intrinsic polycrystalline silicon thin-film transistor; pseudo sub-threshold; quasi two-dimensional conduction model; Dielectrics; Electrodes; Electron traps; Electrostatics; Energy barrier; Grain boundaries; MOSFET circuits; Silicon; Thermionic emission; Thin film transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State and Integrated-Circuit Technology, 2008. ICSICT 2008. 9th International Conference on
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4244-2185-5
  • Electronic_ISBN
    978-1-4244-2186-2
  • Type

    conf

  • DOI
    10.1109/ICSICT.2008.4734531
  • Filename
    4734531