• DocumentCode
    2143405
  • Title

    Capturing post-silicon variation by layout-aware path-delay testing

  • Author

    Zhang, Xiaolin ; Ye, Jing ; Hu, Yu ; Li, Xiaowei

  • Author_Institution
    State Key Laboratory of Computer Architecture, Institute of Computing Technology, Chinese Academy of Sciences, China
  • fYear
    2013
  • fDate
    18-22 March 2013
  • Firstpage
    288
  • Lastpage
    291
  • Abstract
    With aggressive device scaling, the impact of parameter variation is becoming more prominent, which results in the uncertainty of a chip´s performance. Techniques that capture post-silicon variation by deploying on-chip monitors suffer from serious area overhead and low testing reliability, while techniques using non-invasion test are limited in small scale circuits. In this paper, a novel layout-aware post-silicon variation extraction method which is based on non-invasive path-delay test is proposed. The key technique of the proposed method is a novel layout-aware heuristic path selection algorithm which takes the spatial correlation and linear dependence between paths into consideration. Experimental results show that the proposed technique can obtain an accurate timing variation distribution with zero area overhead. Moreover, the test cost is much smaller than the existing non-invasion method.
  • Keywords
    Delays; Fitting; Logic gates; Monitoring; Temperature measurement; Testing; layout-aware; path selection; path-delay testing; variation extraction;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design, Automation & Test in Europe Conference & Exhibition (DATE), 2013
  • Conference_Location
    Grenoble, France
  • ISSN
    1530-1591
  • Print_ISBN
    978-1-4673-5071-6
  • Type

    conf

  • DOI
    10.7873/DATE.2013.071
  • Filename
    6513517