DocumentCode
2143405
Title
Capturing post-silicon variation by layout-aware path-delay testing
Author
Zhang, Xiaolin ; Ye, Jing ; Hu, Yu ; Li, Xiaowei
Author_Institution
State Key Laboratory of Computer Architecture, Institute of Computing Technology, Chinese Academy of Sciences, China
fYear
2013
fDate
18-22 March 2013
Firstpage
288
Lastpage
291
Abstract
With aggressive device scaling, the impact of parameter variation is becoming more prominent, which results in the uncertainty of a chip´s performance. Techniques that capture post-silicon variation by deploying on-chip monitors suffer from serious area overhead and low testing reliability, while techniques using non-invasion test are limited in small scale circuits. In this paper, a novel layout-aware post-silicon variation extraction method which is based on non-invasive path-delay test is proposed. The key technique of the proposed method is a novel layout-aware heuristic path selection algorithm which takes the spatial correlation and linear dependence between paths into consideration. Experimental results show that the proposed technique can obtain an accurate timing variation distribution with zero area overhead. Moreover, the test cost is much smaller than the existing non-invasion method.
Keywords
Delays; Fitting; Logic gates; Monitoring; Temperature measurement; Testing; layout-aware; path selection; path-delay testing; variation extraction;
fLanguage
English
Publisher
ieee
Conference_Titel
Design, Automation & Test in Europe Conference & Exhibition (DATE), 2013
Conference_Location
Grenoble, France
ISSN
1530-1591
Print_ISBN
978-1-4673-5071-6
Type
conf
DOI
10.7873/DATE.2013.071
Filename
6513517
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