• DocumentCode
    2143570
  • Title

    Deep-submicron tungsten gate CMOS technology

  • Author

    Kasai, N. ; Endo, N. ; Ishitani, A.

  • Author_Institution
    NEC Corp., Sagamihara, Japan
  • fYear
    1988
  • fDate
    11-14 Dec. 1988
  • Firstpage
    242
  • Lastpage
    245
  • Abstract
    A tungsten-gate CMOS technology has been developed using a low-impurity selective epi-channel and thin gate oxide. The use of this technology leads to a reduction in threshold-voltage sensitivity to process fluctuations such as epi-channel concentration and gate-oxide thickness. The short-channel effect for deep submicron gate MOSFETs can be suppressed by a 50 approximately 10-nm-thick epi-layer with an abrupt impurity profile. Device characteristics for the tungsten gate show several advantages over those for the present poly-Si gate, including approximately 30% larger transconductance and small threshold slope values (80 approximately 85 mV/decade) that results in a large on/off ratio.<>
  • Keywords
    CMOS integrated circuits; integrated circuit technology; tungsten; W gate; abrupt impurity profile; deep submicron gate MOSFETs; epi-channel concentration; epi-layer; gate-oxide thickness; large on/off ratio; low-impurity selective epi-channel; process fluctuations; reduction in threshold-voltage sensitivity; short-channel effect; thin gate oxide; threshold slope; transconductance; CMOS technology; Contamination; Fluctuations; Impurities; Insulation; Ion implantation; Laboratories; MOSFETs; Threshold voltage; Tungsten;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 1988. IEDM '88. Technical Digest., International
  • Conference_Location
    San Francisco, CA, USA
  • ISSN
    0163-1918
  • Type

    conf

  • DOI
    10.1109/IEDM.1988.32801
  • Filename
    32801