DocumentCode
2143570
Title
Deep-submicron tungsten gate CMOS technology
Author
Kasai, N. ; Endo, N. ; Ishitani, A.
Author_Institution
NEC Corp., Sagamihara, Japan
fYear
1988
fDate
11-14 Dec. 1988
Firstpage
242
Lastpage
245
Abstract
A tungsten-gate CMOS technology has been developed using a low-impurity selective epi-channel and thin gate oxide. The use of this technology leads to a reduction in threshold-voltage sensitivity to process fluctuations such as epi-channel concentration and gate-oxide thickness. The short-channel effect for deep submicron gate MOSFETs can be suppressed by a 50 approximately 10-nm-thick epi-layer with an abrupt impurity profile. Device characteristics for the tungsten gate show several advantages over those for the present poly-Si gate, including approximately 30% larger transconductance and small threshold slope values (80 approximately 85 mV/decade) that results in a large on/off ratio.<>
Keywords
CMOS integrated circuits; integrated circuit technology; tungsten; W gate; abrupt impurity profile; deep submicron gate MOSFETs; epi-channel concentration; epi-layer; gate-oxide thickness; large on/off ratio; low-impurity selective epi-channel; process fluctuations; reduction in threshold-voltage sensitivity; short-channel effect; thin gate oxide; threshold slope; transconductance; CMOS technology; Contamination; Fluctuations; Impurities; Insulation; Ion implantation; Laboratories; MOSFETs; Threshold voltage; Tungsten;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 1988. IEDM '88. Technical Digest., International
Conference_Location
San Francisco, CA, USA
ISSN
0163-1918
Type
conf
DOI
10.1109/IEDM.1988.32801
Filename
32801
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