Title :
Deep-submicron tungsten gate CMOS technology
Author :
Kasai, N. ; Endo, N. ; Ishitani, A.
Author_Institution :
NEC Corp., Sagamihara, Japan
Abstract :
A tungsten-gate CMOS technology has been developed using a low-impurity selective epi-channel and thin gate oxide. The use of this technology leads to a reduction in threshold-voltage sensitivity to process fluctuations such as epi-channel concentration and gate-oxide thickness. The short-channel effect for deep submicron gate MOSFETs can be suppressed by a 50 approximately 10-nm-thick epi-layer with an abrupt impurity profile. Device characteristics for the tungsten gate show several advantages over those for the present poly-Si gate, including approximately 30% larger transconductance and small threshold slope values (80 approximately 85 mV/decade) that results in a large on/off ratio.<>
Keywords :
CMOS integrated circuits; integrated circuit technology; tungsten; W gate; abrupt impurity profile; deep submicron gate MOSFETs; epi-channel concentration; epi-layer; gate-oxide thickness; large on/off ratio; low-impurity selective epi-channel; process fluctuations; reduction in threshold-voltage sensitivity; short-channel effect; thin gate oxide; threshold slope; transconductance; CMOS technology; Contamination; Fluctuations; Impurities; Insulation; Ion implantation; Laboratories; MOSFETs; Threshold voltage; Tungsten;
Conference_Titel :
Electron Devices Meeting, 1988. IEDM '88. Technical Digest., International
Conference_Location :
San Francisco, CA, USA
DOI :
10.1109/IEDM.1988.32801