DocumentCode :
2143936
Title :
Statistical prediction of NBTI-induced circuit aging
Author :
Wang, Wenping ; Balakrishnan, Varsha ; Yang, Bo ; Cao, Yu
Author_Institution :
Dept. of Electr. Eng., Arizona State Univ., Tempe, AZ, USA
fYear :
2008
fDate :
20-23 Oct. 2008
Firstpage :
416
Lastpage :
419
Abstract :
Accurate prediction of circuit aging and its variability is essential to reliable design and analysis. Such a capability further helps reduce the load in statistical reliability test. Based on the physical understanding of circuit aging effects, we develop a predictive short term and long term model to characterize NBTI-induced threshold voltage degradation (¿Vth) at transistor level. Due to process variations, we further develop analytical solutions that efficiently predict the statistics of circuit timing under temporal stress and process variations. These solutions prove that circuit aging and its variance can be fully predicted from the characteristics of transistor degradation and circuit performance sensitivity to aged parameters, independent on the type and the amount of process variations. The results are systematically validated by simulation and measurement data from an industrial 65 nm technology, enhancing the predictability and efficiency of statistical reliability analysis.
Keywords :
CMOS integrated circuits; integrated circuit reliability; semiconductor process modelling; statistical analysis; transistors; CMOS technology; NBTI-induced circuit aging; NBTI-induced threshold voltage degradation; circuit performance sensitivity; circuit timing; negative-bias-temperature-instability; process variations; size 65 nm; statistical reliability analysis; temporal stress; transistor degradation; Aging; Analytical models; Circuit optimization; Circuit testing; Degradation; Predictive models; Statistical analysis; Stress; Threshold voltage; Timing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State and Integrated-Circuit Technology, 2008. ICSICT 2008. 9th International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-2185-5
Electronic_ISBN :
978-1-4244-2186-2
Type :
conf
DOI :
10.1109/ICSICT.2008.4734563
Filename :
4734563
Link To Document :
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