DocumentCode :
2144360
Title :
High resolution time domain and frequency domain package characterization up to 65 GHz
Author :
Engl, M. ; Schiller, K. ; Eurskens, W. ; Weigel, R.
Author_Institution :
Infineon Technol. AG, Neubiberg
fYear :
0
fDate :
0-0 0
Abstract :
We present a measurement setup for high resolution time domain and frequency domain package characterization. The measurement setup features a sub-mm spatial resolution, which enables accurate time domain measurements of actual small sized package types. We evaluate common calibration techniques and their suitability for package characterization in order to get most accurate measurement results. Further, we demonstrate the versatile utilization of time domain measurement techniques. Accurate impedance characterization and fault analysis of packages is achieved. In addition, we show frequency domain characterization of packages up to 65 GHz
Keywords :
calibration; electronics packaging; microstrip transitions; millimetre wave measurement; network analysers; time-domain reflectometry; calibration techniques; fault analysis; frequency domain characterization; impedance characterization; measurement setup; package characterization; small-sized package; time domain measurements; Calibration; Coaxial components; Frequency domain analysis; Impedance; Instruments; Packaging; Reflection; Spatial resolution; Time measurement; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2006. Proceedings. 56th
Conference_Location :
San Diego, CA
ISSN :
0569-5503
Print_ISBN :
1-4244-0152-6
Type :
conf
DOI :
10.1109/ECTC.2006.1645817
Filename :
1645817
Link To Document :
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