High resolution time domain and frequency domain package characterization up to 65 GHz

Author

Engl, M. ; Schiller, K. ; Eurskens, W. ; Weigel, R.

Author_Institution

Infineon Technol. AG, Neubiberg

fYear

0

fDate

0-0 0

Abstract

We present a measurement setup for high resolution time domain and frequency domain package characterization. The measurement setup features a sub-mm spatial resolution, which enables accurate time domain measurements of actual small sized package types. We evaluate common calibration techniques and their suitability for package characterization in order to get most accurate measurement results. Further, we demonstrate the versatile utilization of time domain measurement techniques. Accurate impedance characterization and fault analysis of packages is achieved. In addition, we show frequency domain characterization of packages up to 65 GHz

Keywords

calibration; electronics packaging; microstrip transitions; millimetre wave measurement; network analysers; time-domain reflectometry; calibration techniques; fault analysis; frequency domain characterization; impedance characterization; measurement setup; package characterization; small-sized package; time domain measurements; Calibration; Coaxial components; Frequency domain analysis; Impedance; Instruments; Packaging; Reflection; Spatial resolution; Time measurement; Voltage;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2006. Proceedings. 56th

Conference_Location

San Diego, CA

ISSN

0569-5503

Print_ISBN

1-4244-0152-6

Type

conf

DOI

10.1109/ECTC.2006.1645817

Filename

1645817