DocumentCode :
2144406
Title :
The scalable modeling of multi-layer embedded capacitor based on LTCC substrate
Author :
Park, Jongbae ; Lu, Albert Chee W ; Fan, Wei ; Wai, Lai L. ; Chua, Kai M. ; Shim, Yujeong ; Kim, Joungho
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., Korea Adv. Inst. of Sci. & Technol., Daejon
fYear :
0
fDate :
0-0 0
Abstract :
Low temperature co-fired ceramic (LTCC) technology is the preferred platform for integrating multi-layer capacitors due to excellent high frequency performance and low-loss dielectric properties. This letter describes an approach to perform modeling of multi-layer capacitors in LTCC technology. This hybrid approach combines both analytical modeling and numerical modeling to provide a scalable circuit model predicting the self-resonance frequency of the multiple dielectric and electrode layers. Good correlation between the simulation results and network analyzer measurements has been also achieved
Keywords :
ceramic capacitors; ceramic packaging; dielectric materials; integrated circuit modelling; resonance; substrates; LTCC substrate; dielectric properties; hybrid approach; multilayer embedded capacitor; network analyzer measurements; scalable circuit model; self-resonance frequency; Analytical models; Capacitors; Ceramics; Circuits; Dielectric substrates; Electrodes; Frequency; Numerical models; Predictive models; Temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2006. Proceedings. 56th
Conference_Location :
San Diego, CA
ISSN :
0569-5503
Print_ISBN :
1-4244-0152-6
Type :
conf
DOI :
10.1109/ECTC.2006.1645819
Filename :
1645819
Link To Document :
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