DocumentCode :
2144469
Title :
The compatibility analysis of thread migration and DVFS in multi-core processor
Author :
Oh, Dongkeun ; Chen, Charlie Chung Ping ; Kim, NamSung ; Hu, Yu Hen
Author_Institution :
Univ. of Wisconsin, Madison, WI, USA
fYear :
2010
fDate :
22-24 March 2010
Firstpage :
866
Lastpage :
871
Abstract :
Integrating multiple cores into a processor increases the heat density significantly, which often constrains the maximum performance of such a processor. There have been many techniques using dynamic voltage and frequency scaling (DVFS) and thread migration to manipulate heat dissipation in thermally-constrained multi-core processors. However, most of them were analyzed and applied individually for optimizing the performance of the multi-core processors while their computational cost for the optimization was not studied well. In this paper, we argue that a coherent organization of two techniques can maximize the performance of the multi-core processors with the least performance overheads associated with the thermal management techniques. Furthermore, we also propose an efficient method to optimize the performance of thermal-constrained multi-core processors. According to our experiment, we achieved 5% throughput improvement with negligible computation cost.
Keywords :
convex programming; microprocessor chips; multiprocessing systems; power aware computing; compatibility analysis; dynamic voltage and frequency scaling; multicore processor; thermal management techniques; thread migration; Computational efficiency; Dynamic voltage scaling; Frequency; Manipulator dynamics; Multicore processing; Optimization methods; Performance analysis; Thermal management; Throughput; Yarn; Multi-core processor; dynamic voltage and frequency scaling; thermal simulation; thread-migration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Quality Electronic Design (ISQED), 2010 11th International Symposium on
Conference_Location :
San Jose, CA
ISSN :
1948-3287
Print_ISBN :
978-1-4244-6454-8
Type :
conf
DOI :
10.1109/ISQED.2010.5450478
Filename :
5450478
Link To Document :
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