Title :
A 60GHz radio chipset fully-integrated in a low-cost packaging technology
Author :
Pfeiffer, U. ; Grzyb, J. ; Liu, D. ; Gaucher, B. ; Beukema, T. ; Floyd, B. ; Reynolds, S.
Author_Institution :
IBM T.J. Watson Res. Center, Yorktown Heights, NY
Abstract :
We present a cost-effective plastic packaging technology for a fully-integrated 60GHz radio, used for communication in the 60GHz ISM band. The chipset supports 1-3 Gbps directional links using a ASK or PSK modulation, or it can be used in 500Mbps-1Gbps omni-directional links using an OFDM modulation. The antenna is integrated inside of the package and does not require any high-frequency external connection. The fabrication process of a direct-chip-attach (DCA) and surface mountable land-grid-array (LGA) package technology is presented. Both packages are robust against variations of the electrical properties of standard plastic mold materials
Keywords :
OFDM modulation; amplitude shift keying; integrated circuit packaging; microwave antennas; microwave links; millimetre wave integrated circuits; phase shift keying; plastic packaging; 0.5 to 1 Gbit/s; 1 to 3 Gbit/s; 60 GHz; ASK modulation; OFDM modulation; PSK modulation; direct-chip-attach process; directional links; electrical properties; fabrication process; integrated antenna; land-grid-array package; omni-directional links; plastic mold materials; plastic packaging; radio chipset; Chip scale packaging; Dielectric materials; Fabrication; Integrated circuit technology; OFDM modulation; Packaging machines; Plastic packaging; Robustness; Surface-mount technology; Voltage-controlled oscillators;
Conference_Titel :
Electronic Components and Technology Conference, 2006. Proceedings. 56th
Conference_Location :
San Diego, CA
Print_ISBN :
1-4244-0152-6
DOI :
10.1109/ECTC.2006.1645830
