DocumentCode :
2145132
Title :
FinFET reliability study by forward gated-diode method
Author :
Ma, Chenyue ; Bo Li ; Wei, Yiqun ; Zhang, Lining ; He, Jin ; Zhang, Xing ; Lin, Xinnan
Author_Institution :
Sch. of Electron. & Comput. Sci., Peking Univ., Beijing, China
fYear :
2008
fDate :
20-23 Oct. 2008
Firstpage :
644
Lastpage :
647
Abstract :
Reliability of FinFETs is studied in this paper using the forward gated-diode generation-recombination (G-R) current. It is observed that the stress induced interface states result in the shift of the peak G-R current (¿Ipeak) in the body current (Ib) versus gate voltage (Vg) characteristic, therefore the variation of interface states with stress time was calculated. In the hot carrier injection (HCI) stress condition, the evident difference of the output current degradation was achieved by interchanging the source and drain of FinFET. This phenomenon indicated the asymmetric distribution of the interface states along the channel, and the deduction was demonstrated by extracting the distribution of the interface states subsequently. Moreover, the generation of the interface states induce by HCI was estimated from the output characteristic.
Keywords :
MOSFET; charge injection; hot carriers; interface states; semiconductor device measurement; semiconductor device reliability; FinFET reliability; HCI stress condition; body current characteristic; forward gated-diode generation-recombination current; gate voltage characteristics; hot carrier injection; output current degradation; peak G-R current; stress induced interface states; stress time calculation; CMOS technology; Degradation; Dielectric substrates; FinFETs; Hot carrier injection; Human computer interaction; Interface states; Laboratories; Stress; Voltage; FinFET; G-R current; distribution; interface state; reliability issue; stress;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State and Integrated-Circuit Technology, 2008. ICSICT 2008. 9th International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-2185-5
Electronic_ISBN :
978-1-4244-2186-2
Type :
conf
DOI :
10.1109/ICSICT.2008.4734613
Filename :
4734613
Link To Document :
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