• DocumentCode
    2145132
  • Title

    FinFET reliability study by forward gated-diode method

  • Author

    Ma, Chenyue ; Bo Li ; Wei, Yiqun ; Zhang, Lining ; He, Jin ; Zhang, Xing ; Lin, Xinnan

  • Author_Institution
    Sch. of Electron. & Comput. Sci., Peking Univ., Beijing, China
  • fYear
    2008
  • fDate
    20-23 Oct. 2008
  • Firstpage
    644
  • Lastpage
    647
  • Abstract
    Reliability of FinFETs is studied in this paper using the forward gated-diode generation-recombination (G-R) current. It is observed that the stress induced interface states result in the shift of the peak G-R current (¿Ipeak) in the body current (Ib) versus gate voltage (Vg) characteristic, therefore the variation of interface states with stress time was calculated. In the hot carrier injection (HCI) stress condition, the evident difference of the output current degradation was achieved by interchanging the source and drain of FinFET. This phenomenon indicated the asymmetric distribution of the interface states along the channel, and the deduction was demonstrated by extracting the distribution of the interface states subsequently. Moreover, the generation of the interface states induce by HCI was estimated from the output characteristic.
  • Keywords
    MOSFET; charge injection; hot carriers; interface states; semiconductor device measurement; semiconductor device reliability; FinFET reliability; HCI stress condition; body current characteristic; forward gated-diode generation-recombination current; gate voltage characteristics; hot carrier injection; output current degradation; peak G-R current; stress induced interface states; stress time calculation; CMOS technology; Degradation; Dielectric substrates; FinFETs; Hot carrier injection; Human computer interaction; Interface states; Laboratories; Stress; Voltage; FinFET; G-R current; distribution; interface state; reliability issue; stress;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State and Integrated-Circuit Technology, 2008. ICSICT 2008. 9th International Conference on
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4244-2185-5
  • Electronic_ISBN
    978-1-4244-2186-2
  • Type

    conf

  • DOI
    10.1109/ICSICT.2008.4734613
  • Filename
    4734613