DocumentCode
2145132
Title
FinFET reliability study by forward gated-diode method
Author
Ma, Chenyue ; Bo Li ; Wei, Yiqun ; Zhang, Lining ; He, Jin ; Zhang, Xing ; Lin, Xinnan
Author_Institution
Sch. of Electron. & Comput. Sci., Peking Univ., Beijing, China
fYear
2008
fDate
20-23 Oct. 2008
Firstpage
644
Lastpage
647
Abstract
Reliability of FinFETs is studied in this paper using the forward gated-diode generation-recombination (G-R) current. It is observed that the stress induced interface states result in the shift of the peak G-R current (¿Ipeak) in the body current (Ib) versus gate voltage (Vg) characteristic, therefore the variation of interface states with stress time was calculated. In the hot carrier injection (HCI) stress condition, the evident difference of the output current degradation was achieved by interchanging the source and drain of FinFET. This phenomenon indicated the asymmetric distribution of the interface states along the channel, and the deduction was demonstrated by extracting the distribution of the interface states subsequently. Moreover, the generation of the interface states induce by HCI was estimated from the output characteristic.
Keywords
MOSFET; charge injection; hot carriers; interface states; semiconductor device measurement; semiconductor device reliability; FinFET reliability; HCI stress condition; body current characteristic; forward gated-diode generation-recombination current; gate voltage characteristics; hot carrier injection; output current degradation; peak G-R current; stress induced interface states; stress time calculation; CMOS technology; Degradation; Dielectric substrates; FinFETs; Hot carrier injection; Human computer interaction; Interface states; Laboratories; Stress; Voltage; FinFET; G-R current; distribution; interface state; reliability issue; stress;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State and Integrated-Circuit Technology, 2008. ICSICT 2008. 9th International Conference on
Conference_Location
Beijing
Print_ISBN
978-1-4244-2185-5
Electronic_ISBN
978-1-4244-2186-2
Type
conf
DOI
10.1109/ICSICT.2008.4734613
Filename
4734613
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