• DocumentCode
    2145213
  • Title

    Investigations on proton-irradiation-induced spacer damage in deep-submicron MOSFETs

  • Author

    Xue, Shoubin ; Wang, Pengfei ; Huang, Ru ; Wu, Dake ; Pei, Yunpeng ; Wang, Wenhua ; Zhang, Xing

  • Author_Institution
    Key Lab. of Microelectron. Devices & Circuits, Peking Univ., Beijing, China
  • fYear
    2008
  • fDate
    20-23 Oct. 2008
  • Firstpage
    655
  • Lastpage
    658
  • Abstract
    In this paper, we have focused our attention on DC characteristics degradation of 0.18 ¿m MOSFETs after 10-MeV proton irradiation. It is shown that the threshold voltage shift, the transconductance degradation and the saturation drain current decrease are lager in PMOSFETs, while small effects are exhibited in NMOSFETs. From the analysis, it is concluded that the basic damage mechanism is not ascribed to the gate oxide and the isolation. The origin of the observed changes is due to the damage in spacer oxides of the MOSFETs. The mechanism involved is that the energetic protons incident on the spacer region lose their energy to displace the atoms, give rise to many defects, and create a disordered region (displacement damage region), where many defects and traps can capture positive charges to make the static characteristics degraded. Therefore, it is pointed out that the sidewalls are one of sensitive regions for irradiation hardness.
  • Keywords
    MOSFET; proton effects; radiation hardening (electronics); DC characteristics; NMOSFET; PMOSFET; damage mechanism; deep-submicron MOSFET; electron volt energy 10 MeV; proton irradiation; proton-irradiation-induced spacer damage; size 0.18 mum; static characteristics; threshold voltage shift; transconductance degradation; CMOS technology; Circuits; Degradation; Dielectric breakdown; Laboratories; MOSFETs; Microelectronics; Protons; Space technology; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State and Integrated-Circuit Technology, 2008. ICSICT 2008. 9th International Conference on
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4244-2185-5
  • Electronic_ISBN
    978-1-4244-2186-2
  • Type

    conf

  • DOI
    10.1109/ICSICT.2008.4734616
  • Filename
    4734616