Title :
Processing and performance of broadband integrated resistor structures on non-planar topologies in hermetic silicon enclosure with vertical micro vias
Author :
Greisen, Christoffer Graae ; Hauffe, Ralf ; Shiv, Lior ; Weichel, Steen ; Korth, Hilmar ; Kilian, Arnd ; Heschel, Matthias ; Kuhmann, Jochen
Author_Institution :
Hymite A/S, Lyngby
Abstract :
We present the integration of thin film nickel-chromium (NiCr) resistors into a hermetic, 3D structured silicon packaging platform for wafer level sealing and demonstrate their performance as broadband passive components. Resistors on the cavity side walls can be designed by modeling the material deposition as a unidirectional flux
Keywords :
chromium alloys; electrodeposition; network topology; nickel alloys; passive networks; thin film resistors; NiCr; broadband integrated resistor; broadband passive components; silicon packaging; thin film resistors; vertical micro vias; wafer level sealing; Conducting materials; Etching; Gold; Metallization; Packaging; Resistors; Semiconductor thin films; Silicon; Substrates; Topology;
Conference_Titel :
Electronic Components and Technology Conference, 2006. Proceedings. 56th
Conference_Location :
San Diego, CA
Print_ISBN :
1-4244-0152-6
DOI :
10.1109/ECTC.2006.1645860
