• DocumentCode
    2146706
  • Title

    Experimental investigations of surface flashover characteristics of some common used insulation mediums under impulse voltage in vacuum

  • Author

    Wang, Meng ; Deng, Jianjun ; Dai, Guangsen ; Han, Min ; Wang, Xin

  • Author_Institution
    Inst. of Fluid Phys., China Acad. of Eng. Phys., Sichuan, China
  • fYear
    2002
  • fDate
    2002
  • Firstpage
    547
  • Lastpage
    551
  • Abstract
    This paper has investigated the surface flashover characteristics of some common used insulation mediums, such as Nylon and Lucite, under an impulse voltage in vacuum with a set of experimental device. The half-angle of insulation frustum varied from 0 degree to 60 degree The rise-time and fall-time of applied impulse voltage were all 20 ns, and the flat-width of voltage varied from about 30 ns to 160 ns. The phenomena of surface flashover of each specimen in high vacuum have been observed. Based on the results of a series of experiments and computer simulations, the paper obtained the relationships between the thickness of insulator, the half-angle of frustum and the flashover voltage under impulse condition, and discovered the rule between field stress of triple-junction and actual flashover voltage. The results of this paper have been applied in the special insulation structure designing.
  • Keywords
    electrical engineering computing; flashover; insulation testing; vacuum breakdown; vacuum insulation; 20 ns; 30 to 160 ns; Lucite; Nylon; computer simulations; flashover voltage; impulse voltage; insulation frustum half-angle; insulator thickness; surface flashover characteristics; triple-junction field stress; vacuum insulation; Anodes; Cathodes; Dielectrics and electrical insulation; Electrodes; Electron emission; Flashover; Solids; Stress; Surface charging; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Discharges and Electrical Insulation in Vacuum, 2002. 20th International Symposium on
  • Print_ISBN
    0-7803-7394-4
  • Type

    conf

  • DOI
    10.1109/ISDEIV.2002.1027430
  • Filename
    1027430