Title :
High-performance flip-chip BGA technology based on thin-core and coreless package substrate
Author :
Koide, Masateru ; Fukuzono, Kenji ; Yoshimura, Hideaki ; Sato, Toshihisa ; Abe, Kenichiro ; Fujisaki, Hidehiko
Author_Institution :
Fujitsu Ltd., Kanagaw
Abstract :
A new organic build-up substrate packaging technology was developed in Fujitsu for high-end servers, where lower V-G impedance on substrate and thermal resistance are realized by applying metallic thermal injection materials. In the present paper, two important accomplishments in assembling process, eliminating voids with metallic thermal injection and controlling substrate flatness on mounting large LSIs, are investigated, and evaluated
Keywords :
ball grid arrays; chip scale packaging; flip-chip devices; large scale integration; microassembling; substrates; thermal resistance; LSI; assembling process; coreless package substrate; flip-chip BGA technology; high-end servers; high-performance technology; lower V-G impedance; metallic thermal injection; substrate flatness; substrate packaging; surface mounting; thermal resistance; thin-core; Assembly; Capacitors; Electric resistance; Electronic packaging thermal management; Inductance; Large scale integration; Substrates; Thermal resistance; Thermal stresses; Transistors;
Conference_Titel :
Electronic Components and Technology Conference, 2006. Proceedings. 56th
Conference_Location :
San Diego, CA
Print_ISBN :
1-4244-0152-6
DOI :
10.1109/ECTC.2006.1645915
