DocumentCode :
2146935
Title :
Future memory and interconnect technologies
Author :
Yuan Xie
Author_Institution :
Pennsylvania State University, USA
fYear :
2013
fDate :
18-22 March 2013
Firstpage :
964
Lastpage :
969
Abstract :
The improvement of the computer system performance is constrained by the well-known memory wall and power wall. It has been recognized that the memory architecture and the interconnect architecture are becoming the overwhelming bottleneck in computer performance. Disruptive technologies, such as emerging non-volatile memory (NVM) technologies, 3D integration, and optical interconnects, are envisioned as promising future memory and interconnect technologies that can fundamentally change the landscape of the future computer architecture design with profound impact. This invited survey paper gives a brief introduction of these future memory and interconnect technologies, discusses the opportunities and challenges of these new technologies for future computer system designs.
Keywords :
Memory management; Microprocessors; Nonvolatile memory; Phase change random access memory; Three-dimensional displays;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design, Automation & Test in Europe Conference & Exhibition (DATE), 2013
Conference_Location :
Grenoble, France
ISSN :
1530-1591
Print_ISBN :
978-1-4673-5071-6
Type :
conf
DOI :
10.7873/DATE.2013.202
Filename :
6513648
Link To Document :
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