Title :
Silicon doping of InP, GaAs, In0.53Ga0.47As and In0.49Ga0.51P grown by gas source and metalorganic molecular beam epitaxy using a SiBr4 vapor source
Author :
Jackson, S.L. ; Thomas, S. ; Fresina, M.T. ; Ahmari, D.A. ; Baker, J.E. ; Stillman, G.E.
Author_Institution :
Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
Abstract :
Silicon is the preferred n-type dopant for InP- and GaAs-based device structures due to its low thermal diffusivity and the absence of any surface segregation and memory effect during epitaxial growth. While the use of elemental Si in a standard effusion cell has proven effective for Si doping in gas source molecular beam epitaxy (GSMBE), this method is incompatible with the metalorganic molecular beam epitaxy (MOMBE) growth technique (metalorganic group m and hydride group V sources) due to the formation of a passivating “crust” of C and SiC on the hot Si surface in the presence of metalorganic byproducts. The formation of this crust reduces the effective surface area of the elemental Si charge and subsequently reduces the doping efficiency of the effusion cell. While elemental Sn does not form a carbide and therefore would appear to be an alternative elemental dopant source for MOMBE, anomalous doping behavior, surface segregation and memory effects limit the usefulness of this source as well as its metalorganic compound Sn(C2H5)4. Other vapor sources of Si that have been investigated for doping in GSMBE and MOMBE are SiH4 and Si2H6. However, SiH4 requires precracking for efficient incorporation in GaAs. Since InP and In0.53Ga0.47As are typically grown at substrate temperatures approximately 100°C lower than those employed for GaAs, precracking of SiH4 would also be required with these materials. While Si2H6 is less thermally stable than SiH4, and therefore should crack more efficiently at the growth temperatures employed for InP-based growth by beam epitaxy techniques, its use has been only moderately successful. Using a 10% mixture of Si2H6 in H2 and a flowrate of 10 sccm, Ando and coworkers were only able to obtain a maximum doping concentration of n=1.4×1018 cm-3 in InP grown over the substrate temperature range of 450 to 540°C . Hence a high-efficiency gaseous Si doping source is needed in order for the full advantages of MOMBE to be realized
Keywords :
chemical beam epitaxial growth; effusion; silicon compounds; surface segregation; 450 to 540 C; C; GaAs; In0.49Ga0.51P; In0.53Ga0.47As; InP; MOMBE; Si; SiBr4; SiBr4 vapor source; SiC; crust; epitaxial growth; gas source; hot Si surface; hydride group V sources; low thermal diffusivity; metalorganic byproducts; metalorganic molecular beam epitaxy; n-type dopant; passivating; silicon doping; standard effusion cell; surface segregation; Doping; Electrons; Gallium arsenide; Hydrogen; Indium phosphide; Molecular beam epitaxial growth; Morphology; Silicon; Substrates; Temperature;
Conference_Titel :
Indium Phosphide and Related Materials, 1994. Conference Proceedings., Sixth International Conference on
Conference_Location :
Santa Barbara, CA
Print_ISBN :
0-7803-1476-X
DOI :
10.1109/ICIPRM.1994.328159