• DocumentCode
    2147252
  • Title

    Enhanced flash memory device characteristics using ALD TiN/Al2O3 nanolaminate charge storage layers

  • Author

    Maikap, S. ; Rahaman, S.Z. ; Banerjee, W. ; Lin, C.H. ; Tzeng, P.J. ; Wang, C.C. ; Kao, M.J. ; Tsai, M.J.

  • Author_Institution
    Dept. of Electron. Eng., Chang Gung Univ., Taoyuan, Taiwan
  • fYear
    2008
  • fDate
    20-23 Oct. 2008
  • Firstpage
    958
  • Lastpage
    961
  • Abstract
    Enhanced flash memory device characteristics using ALD TiN/Al2O3 nanolaminate charge storage layers have been investigated. After annealing treatment, the TiN nanocrystals embedded in Al2O3 films with a small diameter of ~3 nm and a high-density of >1×1012/cm2 have been formed. The memory devices show a high programming speed of ¿Vt >1 V@Vg/Vd=8 V/8 V, 10 ¿s and an erasing speed of ¿Vt >1 V@Vg/Vd=-12 V/0 V, 1 ms. The memory window is increased (¿Vt >6.7 V) with increasing the operation voltage. The memory window is also increased with increasing the number of TiN/Al2O3 nanolaminate layers. Good endurance (104 cycles) and retention (charge loss of ~14% at 20°C and ~17% at 85°C after 10 years) characteristics of the TiN nanocrystal memory devices can be explained by both of the high-density and layer-by-layer charge storage in the TiN nanocrystals. This novel nanocrystal memory structure can be useful in future nanoscale flash memory device applications.
  • Keywords
    aluminium compounds; annealing; flash memories; nanocomposites; nanotechnology; titanium compounds; ALD nanolaminate charge storage layers; TiN-Al2O3; annealing treatment; charge loss; enhanced flash memory device; erasing speed; layer-by-layer charge storage; programming speed; Atomic layer deposition; Electron traps; Electronics industry; Flash memory; Industrial electronics; Nanocrystals; Nanoscale devices; Plasma temperature; Substrates; Tin;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State and Integrated-Circuit Technology, 2008. ICSICT 2008. 9th International Conference on
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4244-2185-5
  • Electronic_ISBN
    978-1-4244-2186-2
  • Type

    conf

  • DOI
    10.1109/ICSICT.2008.4734702
  • Filename
    4734702