Title :
Twelfth Annual IEEE Semiconductor Thermal Measurement and Management Symposium. Proceedings
Abstract :
The following topics were dealt with: component level characterization; experimental methods and application; computational and analytical modeling; thermal design for manufacturing and reliability; heat sink modeling and characterization; PCB role in component and system level cooling
Keywords :
circuit reliability; cooling; heat sinks; integrated circuit measurement; integrated circuit modelling; integrated circuit packaging; printed circuits; semiconductor device packaging; semiconductor device reliability; thermal analysis; thermal variables measurement; PCB role; SEMITHERM; analytical modeling; component level characterization; component level cooling; computational modeling; experimental methods; heat sink modeling; manufacturing; packaging; reliability; semiconductor thermal measurement; system level cooling; thermal design; thermal management;
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 1996. SEMI-THERM XII. Proceedings., Twelfth Annual IEEE
Conference_Location :
Austin, TX, USA
Print_ISBN :
0-7803-3139-7
DOI :
10.1109/STHERM.1996.545084
