Title :
Analysis of thermally-enhanced SOIC packages
Author :
Guenin, Bruce M. ; Chowdhury, Asif ; Groover, Richard ; Derian, Edward J.
Author_Institution :
Adv. Products Oper., Amkor Electron. Inc., Chandler, AZ, USA
Abstract :
The thermal performance of a number of thermally-enhanced SOIC (Small Outline Integrated Circuit) designs is evaluated by means of a thermal model utilizing Finite Element Analysis (FEA) and compared to that of a standard design. A number of enhancements are explored: reduced pad-inner lead tip spacing, fused leads, and padless “chip-on-lead” construction, and heat slugs. In most of these cases the impact of replacing the standard epoxy molding compound (MC) with a thermally-enhanced molding compound was investigated. A mathematical technique is demonstrated whereby the die (junction) temperature can be calculated at an arbitrary number of power levels and values of air velocity using the results of a small number of FEA solutions. This technique is particularly efficient when dealing with non-linear boundary conditions involving buoyancy-driven convection and radiation. The predictions of the model were verified for one package type and shown to be in good agreement with experiment
Keywords :
cooling; finite element analysis; forced convection; integrated circuit modelling; integrated circuit packaging; air velocity; buoyancy-driven convection; finite element analysis; fused leads; heat slugs; molding compound; nonlinear boundary conditions; pad-inner lead tip spacing; padless chip-on-lead; small outline integrated circuit; thermal model; thermally-enhanced SOIC packages; Boundary conditions; Electronic packaging thermal management; Finite element methods; Integrated circuit packaging; Performance analysis; Predictive models; Resistance heating; Temperature; Thermal conductivity; Thermal resistance;
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 1996. SEMI-THERM XII. Proceedings., Twelfth Annual IEEE
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-3139-7
DOI :
10.1109/STHERM.1996.545085