DocumentCode
2147505
Title
Thermal management of a C4/ceramic-ball-grid array: the Motorola PowerPC 603TM and PowerPC 604TM RISC microprocessors
Author
Kromann, Gary B.
Author_Institution
Adv. Packaging Technol., Motorola Inc., Austin, TX, USA
fYear
1996
fDate
5-7 Mar 1996
Firstpage
36
Lastpage
42
Abstract
This paper presents various thermal management options available for controlled-collapse-chip-connection (C4) die attached to a ceramic-ball-grid-array substrate (CBGA), as they apply to low-end/midrange computer products. Computational-fluid-dynamics (CFD) methods are used to solve the conjugate heat transfer problems. CFD modeling is used to predict die-junction temperatures for the PowerPC 603 and PowerPC 604 microprocessor in a single-chip C4/CBGA package. The focus is the die temperature rise for a limited range of boundary conditions, including: substrate conductivity, heat sinks and heat sink attach. For the PowerPC 604 microprocessor die-junction temperature rise is presented for convective air cooling (to 4 m/s) using several commercially-available heat sinks
Keywords
cooling; heat sinks; integrated circuit packaging; microprocessor chips; reduced instruction set computing; CFD model; Motorola; PowerPC 603; PowerPC 604; RISC microprocessor; ceramic-ball-grid-array; computational fluid dynamics; computer product; controlled-collapse-chip-connection die; convective air cooling; heat sink; heat transfer; junction temperature; single-chip C4/CBGA package; substrate conductivity; thermal management; Boundary conditions; Computational fluid dynamics; Conductivity; Heat sinks; Heat transfer; Microprocessors; Packaging; Predictive models; Temperature distribution; Thermal management;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Thermal Measurement and Management Symposium, 1996. SEMI-THERM XII. Proceedings., Twelfth Annual IEEE
Conference_Location
Austin, TX
ISSN
1065-2221
Print_ISBN
0-7803-3139-7
Type
conf
DOI
10.1109/STHERM.1996.545089
Filename
545089
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