Title :
Thermal management of a C4/ceramic-ball-grid array: the Motorola PowerPC 603TM and PowerPC 604TM RISC microprocessors
Author :
Kromann, Gary B.
Author_Institution :
Adv. Packaging Technol., Motorola Inc., Austin, TX, USA
Abstract :
This paper presents various thermal management options available for controlled-collapse-chip-connection (C4) die attached to a ceramic-ball-grid-array substrate (CBGA), as they apply to low-end/midrange computer products. Computational-fluid-dynamics (CFD) methods are used to solve the conjugate heat transfer problems. CFD modeling is used to predict die-junction temperatures for the PowerPC 603 and PowerPC 604 microprocessor in a single-chip C4/CBGA package. The focus is the die temperature rise for a limited range of boundary conditions, including: substrate conductivity, heat sinks and heat sink attach. For the PowerPC 604 microprocessor die-junction temperature rise is presented for convective air cooling (to 4 m/s) using several commercially-available heat sinks
Keywords :
cooling; heat sinks; integrated circuit packaging; microprocessor chips; reduced instruction set computing; CFD model; Motorola; PowerPC 603; PowerPC 604; RISC microprocessor; ceramic-ball-grid-array; computational fluid dynamics; computer product; controlled-collapse-chip-connection die; convective air cooling; heat sink; heat transfer; junction temperature; single-chip C4/CBGA package; substrate conductivity; thermal management; Boundary conditions; Computational fluid dynamics; Conductivity; Heat sinks; Heat transfer; Microprocessors; Packaging; Predictive models; Temperature distribution; Thermal management;
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 1996. SEMI-THERM XII. Proceedings., Twelfth Annual IEEE
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-3139-7
DOI :
10.1109/STHERM.1996.545089
