Thermal evaluation of a PowerPC 620 multi-processor computer

Author

Wong, Henry ; Lee, Tien-Yu Tom

Author_Institution

Comput. Group, Motorola Inc., Tempe, AZ, USA

fYear

1996

fDate

5-7 Mar 1996

Firstpage

73

Lastpage

80

Abstract

Passive heat sinks for cooling the PowerPC 620 processor in a multi-processor computer system were analyzed. A Computational Fluid Dynamics software program was used to determine the airflow and air temperatures at the system and board levels. A heat sink was chosen based on estimated thermal requirements and then characterized experimentally under similar flow and geometry conditions found in the system. Data from the simulation and experiments was then combined to calculate junction temperature. Results show the junction temperature can be maintained below 85°C for a 25 Watt processor and 100°C for a 30 Watt processor

Keywords

cooling; flow simulation; fluid dynamics; heat sinks; multiprocessing systems; 100 C; 25 W; 30 W; 85 C; Computational Fluid Dynamics software program; PowerPC 620 processor; air temperature; airflow temperature; cooling; flow simulation; junction temperature; multi-processor computer; passive heat sink; thermal management; Computational fluid dynamics; Cooling; Fans; Geometry; Heat sinks; Manufacturing; Page description languages; Power system reliability; Temperature; Trigeneration;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Thermal Measurement and Management Symposium, 1996. SEMI-THERM XII. Proceedings., Twelfth Annual IEEE

Conference_Location

Austin, TX

ISSN

1065-2221

Print_ISBN

0-7803-3139-7

Type

conf

DOI

10.1109/STHERM.1996.545095

Filename

545095