Title :
3D thermal modeling based on the two-port network theory for hybrid or monolithic integrated power circuits
Author :
Dorkel, J.-M. ; Tounsi, P. ; Leturcq, Ph
Author_Institution :
Lab. d´´Anal. et d´´Archit. des Syst., CNRS, Toulouse, France
Abstract :
This paper recalls how the two-port network theory can be extended to 3D conductive heat transfer in multi-layered plane structures. It is shown how efficient computation tools can be built up by implementing this theory with the help of FFT algorithms. These tools are particularly well-suited for the rapid thermal analysis of power components or hybrid and integrated power circuits. An illustration of the thermal analysis of an IGBT power module is also given
Keywords :
fast Fourier transforms; heat conduction; hybrid integrated circuits; insulated gate bipolar transistors; power integrated circuits; thermal analysis; two-port networks; 3D conductive heat transfer; 3D thermal modeling; FFT algorithms; IGBT power module; computation tools; hybrid power ICs; monolithic power ICs; multi-layered plane structures; power circuits; power components; rapid thermal analysis; two-port network theory; Circuits; Electronic packaging thermal management; Equations; Insulated gate bipolar transistors; Multichip modules; Power electronics; Rapid thermal processing; Temperature distribution; Thermal conductivity; Transient analysis;
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 1996. SEMI-THERM XII. Proceedings., Twelfth Annual IEEE
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-3139-7
DOI :
10.1109/STHERM.1996.545096
