Title :
Thermal analysis and measurement of plastic packaged GaAs devices
Author :
Chien, David H. ; Lee, Chin C. ; Rachlin, Michael ; Peake, Andy ; Kole, Thomas
Author_Institution :
Dept. of Electr. & Comput. Eng., California Univ., Irvine, CA, USA
Abstract :
Three dimensional thermal analyses of a GaAs device in a plastic SOIC package mounted on a printed circuit board are reported. Finite element technique is utilized to analyze the complete structure including the chip, the package and the board. Unit thermal profile method is used to refine the chip level analysis by considering individual heat sources and the die-attach layer. Temperature dependence of GaAs thermal conductivity is taken into account in the analyses. The analysis procedure demonstrates the advantages of both methods. Thermal measurements using liquid crystal microthermography are carried out to validate the modeling results
Keywords :
III-VI semiconductors; finite element analysis; gallium arsenide; integrated circuit modelling; plastic packaging; thermal analysis; thermal conductivity; GaAs; III-V semiconductors; SOIC package; die-attach layer; finite element technique; heat sources; liquid crystal microthermography; plastic packaged devices; printed circuit board; thermal conductivity; three dimensional thermal analyses; unit thermal profile method; Finite element methods; Gallium arsenide; Integrated circuit measurements; Integrated circuit modeling; Lead; Plastic integrated circuit packaging; Plastic packaging; Semiconductor device measurement; Temperature; Thermal conductivity;
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 1996. SEMI-THERM XII. Proceedings., Twelfth Annual IEEE
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-3139-7
DOI :
10.1109/STHERM.1996.545097
