• DocumentCode
    2147730
  • Title

    Ultrahigh-voltage SiC devices for future power infrastructure

  • Author

    Kimoto, Tatsuya

  • Author_Institution
    Dept. of Electron. Sci. & Eng., Kyoto Univ., Kyoto, Japan
  • fYear
    2013
  • fDate
    16-20 Sept. 2013
  • Firstpage
    22
  • Lastpage
    29
  • Abstract
    Silicon carbide (SiC) is a newly-emerging wide bandgap semiconductor, by which high-voltage, low-loss power devices can be realized owing to its superior properties. This paper reviews recent progress in SiC material and device technologies for power device applications. Benefits and remaining issues of ultrahigh-voltage SiC power devices are highlighted. Through progress in fast epitaxy and defect reduction technologies, high-purity (~1014 cm-3) and thick (> 100 μm) SiC epilayers with long carrier lifetimes (> 30 μs) can be employed for fabrication of ultrahigh-voltage devices. By utilizing such epilayers and appropriate junction termination structures, ultrahigh-voltage blocking over 20 kV has been achieved in SiC PiN diodes and transistors.
  • Keywords
    carrier lifetime; power semiconductor devices; silicon compounds; wide band gap semiconductors; PiN diodes; SiC; carrier lifetimes; defect reduction technologies; epilayers; fast epitaxy; future power infrastructure; high-voltage low-loss power devices; junction termination structures; power device applications; silicon carbide; ultrahigh-voltage blocking; ultrahigh-voltage devices; wide bandgap semiconductor; Insulated gate bipolar transistors; MOSFET; Oxidation; PIN photodiodes; Silicon; Silicon carbide; Switches;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Device Research Conference (ESSDERC), 2013 Proceedings of the European
  • Conference_Location
    Bucharest
  • Type

    conf

  • DOI
    10.1109/ESSDERC.2013.6818812
  • Filename
    6818812